Home Archive News Contact
PDF download
Cite article
Share options
Informations, rights and permissions
Issue image
Vol 14, Issue 1, 2023
Pages: 73 - 82
Research article
Metallic materials
See full issue

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. 

Metrics and citations
Abstract views: 57
PDF Downloads: 24
Google scholar: See link
Article content
  1. Abstract
  2. Disclaimer
Published: 01.05.2025. Research article Metallic materials

THERMAL AND MICROSTRUCTURAL ANALYSIS OF THE LOWMELTING Bi–In–Sn TERNARY ALLOYS

By
Ljubiša Balanović ,
Ljubiša Balanović
Contact Ljubiša Balanović

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Dragan Manasijević Orcid logo ,
Dragan Manasijević

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Ivana Marković ,
Ivana Marković

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Milan Gorgijevski ,
Milan Gorgijevski

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Uroš Stamenković ,
Uroš Stamenković

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Dajana Milkić
Dajana Milkić

Measuring Transformers Factory Zaječar , Zaječar , Serbia

Abstract

Low-melting alloys, based on bismuth, indium, and tin, have found commercial use in soldering,
safety devices, coatings, and bonding applications, due to their low melting point temperature of
eutectic compositions and small differences between their liquidus and solidus temperatures.
Based on this, the accurate knowledge of their thermal properties such as melting and
solidification temperatures, latent heat of melting, supercooling tendency, etc. is of immense
importance. In the present research, low-melting alloy from three cross-sections Bi-Sn50In50,
Sn-In50Bi50, and In-Bi50Sn50 (wt.%) was investigated using differential thermal analysis (DTA),
and by scanning electron microscopy (SEM) with energy dispersive spectrometry (EDS).
Temperatures of phase transformations, determined by DTA, and phase compositions of coexisting
phases, determined by EDS analysis, were found to support the corresponding calculated
phase compositions quite well. The experimentally obtained results were compared with the
results of thermodynamic calculation according to the CALPHAD approach, and a close
agreement was noticed.

Funding Statement

This work has been financial supported by the Ministry of Science, Technological Development and Innovations of the Republic of Serbia, with the funding of the scientific research work at the University of Belgrade, Technical Faculty in Bor, according to the contract with registration number 451-03-47/2023-01/200131. The authors are grateful to V.T. Witusiewicz for kindly providing TDB file for thermodynamic calculations.

References

1.
K. Z, Z. T, Y. L, T. W, H. W, T. L, et al. Phase Constitution and Fundamental Physicochemical Properties of Low-Melting-Point Multi- Component Eutectic Alloys. Journal of Materials Science & Technology. 2017;33(2):131–54.
2.
H. L, S.G F. Sundman B.: Computational thermodynamics: the Calphad method.
3.
Saunders N. Miodownik A.P.: CALPHAD (CALculation of PHAse Diagrams): A comprehensive guide. 1998;
4.
Y. P, C. L, K. X, J. Y, C. P, P. G, et al. Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry. Microelectronics Reliability. 2022;135.
5.
S.R. M, H C. Lee H.J.: Investigation of Sn–Bi–In ternary solders with compositions varying from Sn–Bi eutectic point to 76 °C ternary eutectic. Journal of Materials Science: Materials in Electronics. 2022;
6.
E. QC, W AC. Quezada-Alván B.: Ion release from non precious dental alloys in the oral cavity. Revista Materia. 2022;27(2).
7.
V.T. W, U. H, B. B, S R. Thermodynamic re-optimisation of the Bi– In–Sn system based on new experimental data. Journal of Alloys and Compounds. 2007;428(1–2):115–24.
8.
X. C, F. X, J Z. Yao Y.: Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder. Journal of Alloys and Compounds. 2015;633:377–83.
9.
R.M S. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys. Materials Science and Engineering: A. 2013;560:86–95.
10.
C.H. Y, S. Z, S.K L. Nishikawa H.: Development of Sn-Bi-In-Ga quaternary low. In: Temperature solders, 2019 International Conference on Electronics Packaging, ICEP 2019. 2019.
11.
R.M. S, M.A.A.M. S, N. S, M.I.I R. Superconducting Lead-free Solder Joint: A Short Review. IOP Conference Series: Materials Science and Engineering. 2020;957(Issue 1).
12.
F. Y, L. Z, Z.Q. L, S.J. Z, J M. Bao L.: Properties and Microstructures of Sn-Bi-X Lead-Free Solders. Advances in Materials Science and Engineering. 2016;
13.
E.E. MN, A.B. I, N.M. S, T. A, Z H. Characteristic of low temperature of Bi-In-Sn solder alloy. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. 2008.
14.
K. P, G G. Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders. Journal of Materials Science: Materials in Electronics. 2007;18(1):347–65.
15.
K. P, G G. Impact of the ROHS directive on high-performance electronic systems Part I: need for lead utilization in exempt systems. Journal of Materials Science: Materials in Electronics. 2007;18(1):331–46.
16.
Directive 2002/95/EC of the European parliament and of the council on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS. Official Journal of the European Union. 2003;L 37:19–23.
17.
Directive 2002/96/EC of the European parliament and of the council, on waste electrical and electronic equipment (WEEE. Official Journal of the European Union. 2003;L 37:24–38.
18.
H.R. K, P.D H. Mannan S.H.: A review: On the development of low melting temperature Pb-free solders. Microelectronics Reliability. 2014;54(6):1253–73.
19.
C. A, T. M, G. B, C.R.M G. Speller S.C.: Lead-Free Solders for Superconducting Applications. IEEE Transactions on Applied Superconductivity. 2016;26(3).
20.
S. C, C.-M H. Pecht M.: A review of lead-free solders for electronics applications. Microelectronics Reliability. 2017;75:77–95.

The statements, opinions and data contained in the journal are solely those of the individual authors and contributors and not of the publisher and the editor(s). We stay neutral with regard to jurisdictional claims in published maps and institutional affiliations.