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Vol 14, 2023
Pages: 73 - 82
Research article
Metallic materials
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Published: 01.05.2025. Research article Metallic materials

THERMAL AND MICROSTRUCTURAL ANALYSIS OF THE LOWMELTING Bi–In–Sn TERNARY ALLOYS

By
Ljubiša Balanović ,
Ljubiša Balanović
Contact Ljubiša Balanović

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Dragan Manasijević Orcid logo ,
Dragan Manasijević

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Ivana Marković ,
Ivana Marković

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Milan Gorgijevski ,
Milan Gorgijevski

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Uroš Stamenković ,
Uroš Stamenković

Technical Faculty Bor, University of Belgrade , Belgrade , Serbia

Dajana Milkić
Dajana Milkić

Measuring Transformers Factory Zaječar , Zaječar , Serbia

Abstract

Low-melting alloys, based on bismuth, indium, and tin, have found commercial use in soldering,
safety devices, coatings, and bonding applications, due to their low melting point temperature of
eutectic compositions and small differences between their liquidus and solidus temperatures.
Based on this, the accurate knowledge of their thermal properties such as melting and
solidification temperatures, latent heat of melting, supercooling tendency, etc. is of immense
importance. In the present research, low-melting alloy from three cross-sections Bi-Sn50In50,
Sn-In50Bi50, and In-Bi50Sn50 (wt.%) was investigated using differential thermal analysis (DTA),
and by scanning electron microscopy (SEM) with energy dispersive spectrometry (EDS).
Temperatures of phase transformations, determined by DTA, and phase compositions of coexisting
phases, determined by EDS analysis, were found to support the corresponding calculated
phase compositions quite well. The experimentally obtained results were compared with the
results of thermodynamic calculation according to the CALPHAD approach, and a close
agreement was noticed.

Funding Statement

This work has been financial supported by the Ministry of Science, Technological Development and Innovations of the Republic of Serbia, with the funding of the scientific research work at the University of Belgrade, Technical Faculty in Bor, according to the contract with registration number 451-03-47/2023-01/200131. The authors are grateful to V.T. Witusiewicz for kindly providing TDB file for thermodynamic calculations.

References

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2.
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Saunders N. Miodownik A.P.: CALPHAD (CALculation of PHAse Diagrams): A comprehensive guide. 1998;
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Y. P, C. L, K. X, J. Y, C. P, P. G, et al. Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry. Microelectronics Reliability. 2022;135.
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S.R. M, H C. Lee H.J.: Investigation of Sn–Bi–In ternary solders with compositions varying from Sn–Bi eutectic point to 76 °C ternary eutectic. Journal of Materials Science: Materials in Electronics. 2022;

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