Home Archive News Contact
PDF download
Cite article
Share options
Informations, rights and permissions
Issue image
Vol 10, Issue 1, 2014
Pages: 125 - 134
Research article
Metallic materials
See full issue

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. 

Metrics and citations
Abstract views: 37
PDF Downloads: 25
Google scholar: See link
Article content
  1. Abstract
  2. Disclaimer
Published: 24.04.2014. Research article Metallic materials

EFFECT OF MICROSTRUCTURAL CHANGES ON PROPERTIES OF COLD DEFORMED SINTERED COPPER AND Cu-Au ALLOY DURING THE ISOCHRONAL ANNEALING

By
Ivana Marković ,
Ivana Marković
Contact Ivana Marković

Faculty of Engineering in Bor, University of Belgrade , Belgrade , Serbia

Svetlana Nestorović ,
Svetlana Nestorović

Faculty of Engineering in Bor, University of Belgrade , Belgrade , Serbia

Desimir Marković ,
Desimir Marković

Faculty of Engineering in Bor, University of Belgrade , Belgrade , Serbia

Dragana Živković
Dragana Živković

Faculty of Engineering in Bor, University of Belgrade , Belgrade , Serbia

Abstract

This paper studies the effect of annealing on the microstructure and hardness, microhardness and electrical conductivity changes of cold deformed (ε=40%) sintered pure copper and Cu-4at.% Au alloy. The samples of pure copper and Cu-4at.%Au alloy were obtained by sintering, followed by prefinal rolling, quenching and final rolling with 40% reduction. Isochronal annealing was performed from 60oC to 700oC. The sintered Cu-4at.%Au alloy has made a two-step increase in 
hardness, microhardness and electrical conductivity due to anneal hardening effect. The correlation between the microstructural changes and changes in properties was established. 

Funding Statement

Autori se zahvaljuju Ministarstvu prosvete, nauke i tehnološkog razvoja Republike Srbije na finansijskoj pomoći preko projekta TR34003.

References

1.
Varschavsky A, Donosoe. DSC Evaluations in f.c.c. solid solutions of short-range-order kinetics as influenced by bound vacancies. Journal of Thermal Analysis and Calorimetry. 2000;(2):397–413.
2.
Varschavsky A, Donoso E. Short-range-ordering kinetics of Cu-5at%Zn influenced by solutevacancy complexes and cold rolling. Journal of Thermal Analysis and Calorimetry. 2001;(1):185–95.
3.
Vitekj, Warlimonth. The mechanism of anneal hardening in dilute copper alloys. Metallurgical Transactions A. 1979;1889–92.
4.
Bader M, Eldis G, Warlimont H. The mechanisms of anneal hardening in Cu-Al alloys. Metallurgical Transactions A. 1976;249–55.
5.
Lee W, Duggan B. Anneal hardening in α-brass. Metals Technology. 1983;85–8.
6.
Miura S, Tajima T. Effect of grain boundaries on anneal hardening in Cu-Al alloy. Metal Science. 1978;(4):183–91.
7.
Nestorović S, Marković I, Marković D. Influence of thermomechanical treatment on the hardening mechanisms and structural changes of a cast Cu-6.6wt.%Ag alloy. Materials and Design. 2010;1644–9.
8.
Nestorović S, Marković D. Influence of alloying on the anneal hardening effect in sintered copper alloys. Materials Transactions JIM. 1999;(3):222–4.
9.
Rösner H, Kuhlmann O, Nembach E. Dislocation configurations in ordered copper-10 at.% gold solid solutions. Materials Science and Engineering A. 1998;296–8.
10.
Standard test method for Knoop and Vickers hardness of materials. 2010;
11.
Zhu D, Tang K, Song M, Tu M. Effects of annealing process on electrical conductivity and mechanical property of Cu-Te alloys. Transactions of Nonferrous Metals Society of China. 2006;(2):459–62.
12.
Wuz, Liuj, Cheny, Mengl. Microstructure, mechanical properties and electrical conductivity of Cu-12 wt.% Fe microcomposite annealed at different temperatures. Journal of Alloys and Compounds. 2009;213–8.
13.
Luy, Molodovd, Gottsteing. Recrystallization kinetics and microstructure evolution during annealing of a cold-rolled Fe-Mn-C alloy. ActaMaterialia. 2011;3229–43.
14.
Riosp, Jrf, Sandimh, Plautr, Padilhaa. Nucleation and growth during recrystallization. Materials Research. 2005;(3):225–38.
15.
Zlatevag, Martinovaz. LLC. 2008;
16.
Josephg, Kundigk. 2001;

The statements, opinions and data contained in the journal are solely those of the individual authors and contributors and not of the publisher and the editor(s). We stay neutral with regard to jurisdictional claims in published maps and institutional affiliations.